ANSONIA COPPER & BRASS, INC.

 

COPPER ALLOY DATA SHEET

 

C65500 and C66100

 

Everdur C65500 and C66100 are high strength, engineering alloys which have excellent resistance to a wide range of corrosives, including fresh and salt water, most acids, alkalies, salts, and organic chemicals.  However, they are not suitable for use with sulfides, nitric acid, acid chromates, or oxidizing salts such as ferric chloride.  Both alloys have a combination of corrosion resistance, strength, resilience, and formability that makes them among the most widely used copper alloys.  They are also noted to be non-sparking, galling resistant, and fatigue resistant.

 

C65500 is nominally composed of 95.8% copper, 3.3% silicon, and 0.9% manganese, while C66100 is nominally composed of 95.4% copper, 3.1% silicon, 1.0% manganese, and 0.50% lead.  The addition of lead to C66100 makes it more suitable for machining and for applications where machining is the primary fabrication process.  It also makes C66100 less weldable than C65500.

 

Hot Working:  C65500 has excellent hot workability and can be readily hot formed and pressed.  The alloy is basically known for its hot working properties.  Due to its lead content, hot working is not recommended for C66100.

 

Cold Working:  C65500 and C66100 have excellent cold workability.  However, they work-harden rapidly and should not be subjected to severe deformation in operations such as cold heading unless they are subsequently relief annealed to avoid the possibility of stress corrosion cracking.

 

Joining:  C65500 is one of the most weldable copper alloys.  It is readily joined by all types of resistance welding.  Joining by soldering is good, while excellent by brazing.  Joining by gas shielded arc welding and spot welding is excellent, and by oxyacetylene welding, good.  The requirements of the ASME Boiler and Pressure Vessel Code for Unfired Pressure Vessels are readily met by inert-gas arc welding with filler metal of C65600.  C66100 is not as weldable as C65500 due to its lead content.

 

Applications:  Typical applications of C65500 include electrical conduit, pump shafts, valve stems, tie rods, fasteners, marine and pole-line hardware, nuts, bolts, screws, rivets, nails, bushings, screen cloth and wire.  Typical applications of C66100 include bushings and bearings.

 

Applicable Specifications:  When so specified, C65500 and C66100 will be manufactured to the latest revision of the following specifications:  ASTM B98 and B124 (C65500 only) for rod, bar, and shapes, and B99 (C65500) for wire.

 

Standard Forms Available:  Rod, bar, wire (C65500 only), and extruded shapes.

 

ADS No. C65500 and C66100

Rev. No. 2

Rev. Date 2/27/01

C65500 C66100

 

P. O. Box 109 - Ansonia, Connecticut 06401

725 Bank St. – Waterbury, Connecticut 06708

Tel.:  1-800-521-1703        FAX 203-735-3787

Tel.:  1-800-243-3204            FAX 203-756-1330

 


 

 

PROPERTIES OF C65500 and C66100

 

 

 

Nominal Composition:                             C65500                                  C66100

                                                           95.8% Copper                        95.4% Copper

                                                            3.3% Silicon                           3.1% Silicon

                                                        0.9% Manganese                   1.0% Manganese

                                                                                                         0.50% Lead

 

Physical Properties:

 

            Melting Point (Liquidus):                                             C65500 - 1025°C (1880°F)

                                                                                                C66100 - 1019°C (1832°F)

                                    (Solidus):                                             C65500 - 970°C (1780°F)

            Density at 68°F:                                                          0.308 Lbs./ In.3

            Coefficient of Linear Thermal Expansion per °F:        1.00 x 10-5 (68-572°F)

            Electrical Conductivity at 68°F (volumetric):               7.0% IACS (C65500), 6.5% IACS (C66100) (in the annealed condition; lower in hard temper)

            Thermal Conductivity Btu/ft.2/ft./hr./°F at 68°F:          21

            Modulus of Elasticity - Tension:                                  15,000 ksi

            Modulus of Rigidity:                                                    5,600 ksi

 

Fabrication Properties:

 

            Hot Working Temperature:                     700-875°C (1300-1600°F) (C65500)

                                                                           Hot working not recommended for C66100

            Annealing Temperature:                         475-700°C (900-1300°F)

            Approximate Relative Machinability:      30 (C65500), 50 (C66100)

                                                                           (free cutting brass arbitrarily rated at 100)

 

Mechanical Properties:

 

 

 

 

Size and Temper

Tensile Strength

(psi)

Yield Strength

(0.5% EUL) (psi)

% Elongation

(in 2")

Rockwell Hardness

 

 

 

 

 

1.0" Dia. Rod

 

 

 

 

OS050 - 0.050 mm

58,000

22,000

60

HRB 60

H02 -1/2 Hard (20%)

78,000

45,000

35

HRB 85

H04 - Hard (36%)

92,000

55,000

22

HRB 90

H06 - Extra Hard (50%)

108,000

60,000

13

HRB 95

 

 

 

 

 

0.080" Dia. Wire

 

 

 

 

OS035 - 0.035 mm

60,000

25,000

60

--

H00 - 1/8 Hard

70,000

40,000

35

--

H01 - 1/4 Hard

80,000

48,000

20

--

H02 - 1/2 Hard

98,000

57,000

8

--

H04 - Hard

125,000

65,000

5

--

H08 - Spring

145,000

70,000

3

--

 

ADS No. C65500 and C66100

Rev. No. 2

Rev. Date 2/27/01

C65500 C66100

The statements and data provided on this data sheet are to be considered only as a general guide.  Commercial variations in material properties are expected, so values listed here are not intended to be used for specifications.  Please consult the appropriate industry specifications where applicable.  Ansonia Copper & Brass, Inc. also cannot assume responsibility for performance of these products in service because we do not control or supervise subsequent use of our products.